Ampere A. Tseng 

Department of Mechanical
and Aerospace Engineering,
Arizona State University


Arizona State University
Box 876106
Tempe, AZ 85287-6106 

Phone: (480) 965-8201
Fax: (480) 965-2910


Ph.D. Mechanical Engineering, Georgia Institute of Technology, 1978.
MS. Theoretical & Applied Mechanics, University of Illinois at Urbana, 1974.

Areas of Teaching and Research

Micro-device and -system fabrication, Rapid prototyping and fabrication, Metal and Plastic Forming.

Before joining Arizona State University in 1996, Dr. Tseng had been a Professor of Mechanical Engineering at Drexel University for more than ten years. From 1990 to 1994, Professor Tseng led the Drexel's Center for Automation Technology, established by DOE's five million dollars grant, while from 1997 to 2000, he was Co-Director of the ASU Manufacturing Institute. In 1997, the nine million dollars' commitment from Motorola to Manufacturing Institute was the largest single donation in ASU history. Currently Dr. Tseng is interested in doing research in fabrication and prototyping of micro/nano scale structures and devices. He has published more than two hundred technical papers, and received more than three million dollars in research funding from government agencies and industries. Nine US patents in his credit were issued in the past five years. Professor Tseng is a recipient of Martin Marietta Laboratories' Superior Performance Award, ASME Service Award, RCA Laboratories Performance Award, Alcoa Foundation Research Award, and ASU Faculty Award and Citation. Dr. Tseng is heavily involved in professional society activities and has been a member of the editorial boards of several professional journals. Dr. Tseng was the Chair of the ASME Materials Division (1991-1992) and of the 2000 NSF Workshop on Manufacturing of Micro-Electro-Mechanical Systems Workshop. He also co-chaired the 1992 International Conference on Transport Phenomena in Processing and the 1999 NSF USA-China Workshop on Advanced Machine Tool Research. Currently, Professor Tseng is a fellow of ASME and a member of Information and Control Committee of SEMI and was its Educational Partnership Roundtable Chairman. Dr. Tseng has been awarded a Czech/US DOS fellowship, Nippon Steel fellowship and ROC National Science Council Professorship to perform research in Czech, Japan, Taiwan and China, respectively. He was bestowed a guest professorship by Shanghai Jiao Tong University in 2000, Beijing Tsinghua University and University of Science and Technology of China in 2003.

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